SPS(Semiconductor Package Substrate)
It is a core part in semiconductor packaging process, which is a high density board of fine circuit that connects semiconductor's electrical signal to the mainboard.
It is used for automotive and various mobile devices that require high reliability.
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Overview
- Slim-FCBGA (Slim Flip Chip Ball Grid Array)
- It is High-density substrate which is used for accommodating high-density semiconductor chips, connected via Flip Chip Bump.
- Leveraging raw materials based on BT, we could manufacture FCBGA with exceptional electrical characteristics and thinness, hence naming the product Slim-FCBGA.
- Large body size and multi-layer technology are required to meet the demands of high-performance computing.
- Application
- Consumer SoC
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Core Technology
- Pattern Process : MSAP, ETS, PSAP
- Pre-solder
- Singulation
- Large Body Size
- High Layer & Thick Thickness
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Specifications
HVM Sample Layer 2L ~ 10L 14L Singulation Singulation
(Inhouse)← Unit Size 30x30µm 50x50µm Trace Pitch (Width/Space) MSAP 30pt (15/15) 24pt (12/12) PSAP 24pt (12/12) 21pt (9/12) Pre-Solder Type MMP, Micro-ball ← Pitch 120 90 Pre-Solder MMP, Micro-ball ← -
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