SPS(Semiconductor Package Substrate)
It is a core part in semiconductor packaging process, which is a high density board of fine circuit that connects semiconductor's electrical signal to the mainboard.
It is used for automotive and various mobile devices that require high reliability.
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Overview
- FCCSP (Flip Chip Chip Scale Package)
- FCCSP connects the chp to substrate via Bumping instead of Wirebonding.
- In comparison to WBCSP, which employs Gold Wire, FCCSP offers superior performance due to shorter electrical signal paths and enables the formation of numerous bumps, facilitating high-density semiconductor integration.
- Application
- Mobile AP, RCD/DB, SSD Controller, Automotive
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Core Technology
- Pattern Process : MSAP, ETS, PSAP
- Pre-solder
- Fine Pitch
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Specifications
HVM Sample Layer ETS 2L ~ 4L 5L ~ 6L MSAP 2L ~ 8L 10L Trace Pitch (Width/Space) ETS 7/10 6/8 MSAP 15/15 9/12 PSR DFSR SR1, AUS410 ← LPSR AUS320, AUS308 ← Surface Finish Hybrid Ni/Au, OSP, ENEPIG ← Non-Hybrid Selective OSP
(Ni/Au+OSP)Selective OSP
(Ni/Au+OSP)
Selective ENEPIG
(ENEPIG+OSP)Pre-Solder Type MMP, Micro-ball ← -
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