SPS(Semiconductor Package Substrate)
It is a core part in semiconductor packaging process, which is a high density board of fine circuit that connects semiconductor's electrical signal to the mainboard.
It is used for automotive and various mobile devices that require high reliability.
-
Overview
- CSP (Chip Scale Package)
- With the rapid progression of electrification in automobiles, some semiconductor chips are transitioning from leadframe to substrate packaging.
- It demands stability in heat dissipation and high reliability.
- Application
- Automotive (MCU, Power Discrete)
-
Core Technology
- Pattern Process : Tenting
- Thick Cu
-
Specifications
HVM (HVM Ready) Sample Layer & Thickness 2L 520µm ← 4L 330µm ← Line/Space
(Tenting)Cu T 15u 60pt (15/15) ← Cu T 30u 135pt (40/30) ← Line/Space
(MSAP)Cu T 15u 40pt (20/20) ← Cu T 30u 65pt (30/35) ← PSR AUS320, AUS308 ← Surface Ni/Au, ENEPIG ← -
Product Image
