No Title Date file 7 Simmtech Develops Build-up Flip Chip BGA with CMK of Japan 2002/04/08 6 Simmtech and Tessera Agrees on Joint Development Plan for Package Substrate for Wire-bonded µBGA (µBGA-W) 2001/08/11 5 Simmtech Files Applications for Patents on Chip Scale Package (CSP) Technologies 2001/07/31 4 Simmtech Attends Rambus Developer Forum 2001 as a Sole Guest among Korean PCB Makers 2001/06/11 3 Simmtech Submits Patent Application for Process Technology using Plasma under Normal Atmospheric Environment 2001/04/13 2 Agreement on Specification of Flip Chip Build-up BGA 2001/02/07 1 Simmtech Announces Preliminary Results of 70.4 billion won in Sales Revenue and 10.3 billion won in Operating Profit for 2000 2001/02/03 [1]