No Title Date file 17 Simmtech Develops Build-up Flip Chip BGA with CMK of Japan 2002/04/08 16 Simmtech Presents on its Development of Embedded Passives in Laminated PCB 2002/03/20 15 Earnings Release on 2001 Results 2002/03/14 14 Simmtech Presents at CSFB Seoul Technology Conference 2002/03/12 13 Head of Module Assembly of Micron Technology Visits Simmtech 2001/11/09 12 Simmtech Selected as Winner of \"English Cyber IR Awards\" by The Korea Times 2001/09/24 11 Simmtech Completes Renovation of its Website 2001/09/10 10 Earnings Release on 1st Half 2001 Results 2001/08/14 9 Simmtech and Tessera Agrees on Joint Development Plan for Package Substrate for Wire-bonded µBGA (µBGA-W) 2001/08/11 8 Simmtech Files Applications for Patents on Chip Scale Package (CSP) Technologies 2001/07/31 7 Simmtech Attends Rambus Developer Forum 2001 as a Sole Guest among Korean PCB Makers 2001/06/13 6 Simmtech Receives Appreciation Plaque from Chung-ju City for Environment Friendly Management 2001/06/13 5 First Quarter 2001 Investor Conference 2001/04/25 4 CEO and COO Visit Customers in Singapore 2001/04/06 3 Annual Shareholders Meeting 2001/03/23 2 Agreement on Specification of Flip Chip Build-up BGA on February 7, 2001 2001/02/06 1 First Half 2001 Teamwork-SIMMTECH Seminar 2001/01/30 [1]